FPC,Flexible Printed Circuit substrate is made of flexible printed circuit insulation, rigid printed circuit board has many advantages not available. For example, it can be freely bent, winding, folding, can be arranged in accordance with any requirements of the spatial layout, and any movement in three-dimensional space and scale to achieve the component assembly and integration of wire connection. FPC can greatly reduce the use of the volume of electronic products, electronic products applied to high-density, small size, high reliability and direction of development. Therefore, FPC in the aerospace, military, mobile communications, portable computers, computer peripherals, PDA, digital camera and other fields or products have been widely used.
FPC,Flexible printed circuit also has good heat resistance and weldability, and even easy to install, comprehensive and low cost, integrated hardware and software design has to a certain extent, make up the flexible substrate on the carrying capacity of the components slightly less.
FPC,Flexible Printed Circuit with double-sided and multilayer divided. The polyimide substrate used in CCL-based. This material heat resistance, dimensional stability, and both mechanical protection and good electrical insulation properties of the cover film is made by pressing the final product. Double-sided, multilayer printed circuit boards through the surface and the inner conductor layer metallization achieve internal and external electrical circuit connection.

Keywords:PCBA    Printed circuit board   Flexible printed circuit   PCB Assembly

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