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FPC components outlined

time2011/11/10

  Flexible circuit (FPC components) small soft weight of the board was originally designed to replace bulky wiring harness wires. In the current patch (cutting-edge) electronics board assembly, flex circuit is usually small and mobile to meet the requirements of the only solution. Flexible circuit (sometimes referred to as flexible printed circuits) in the polymer substrate is etched copper circuits or printed polymer thick film circuit. For both thin and light, compact and sophisticated device of its structure, its design solutions ranging from single-sided conductive lines to complex three-dimensional multi-layer assembly. Flexible assembly of the total weight and volume than conventional round wire harness methods to reduce by 70%. Flexible circuits can also be enhanced through the use of materials or lining of the ways to increase its strength, in order to obtain additional mechanical stability.
  FPC components flexible circuits can be moving, bending, torsion and will not damage the wire, you can follow a special package of different shapes and sizes. The only limitation is the size of its space. As can withstand millions of times dynamic bend, flex circuit can be a good fit for continuous movement or periodic movements even within the system, as part of the final product features. Rigid PCB solder joint thermal mechanical stress on the role hundreds of times in the cycle will fail. Shel-dahl, Northfield, Minn, product manager Randy Lia said: "The requirements of signal / power movement, and shape factor / small package size of some products have benefited from flexible circuits."
  FPC components flex circuit has excellent electrical properties of dielectric properties of heat-resistant flexible circuits provide excellent electrical performance. New York Inter-national Flex TEchnologies, Endicott, CEO Don friedman said. "Low dielectric constant allows fast transfer of electrical signals; good thermal properties make components easy to cool down; a higher glass transition temperature or melting point of making components at higher temperatures a good run."