pcb production processes

Degree of control of thin copper foil is mainly based on two grounds mountain: a copper foil can have a very uniform
Uniform temperature coefficient of resistance,PCB Design low dielectric constant, so make a smaller loss of signal transmission, which
And capacitance requirements are different, the high dielectric constant capacitors required, so cunning 'can accommodate a limited volume under
Higher capacity, why the resistance is smaller than the head capacitance, high dielectric constant is ultimately ah!
Second, the thin copper foil by a smaller temperature rise under high current conditions, which are heat and component life
Is of great benefit, digital integrated circuits in copper is that the width, preferably less than 0.3cm
A reason. PCB board well-made product is very uniform, shiny and soft (because the surface of the brush
On the solder resist), this can be seen with the naked eye, but just look at the copper substrate can see good and bad
Not many people, unless you are an experienced factory QC.
For a body wrapped in a foil of the PCB substrate, how can we be placed in the top element
Parts, components to achieve a signal between components rather than the entire board of differences through different pass it? Curved around the board
Around the copper wire is used to implement the transmission of electrical signals, so long as we have copper corrosion
Off unused parts, leaving the copper part of it.
How this is done, first of all, we need to understand a concept, that is, 'Line film "
Or call it "line Lufei Lin," we will board the River lithography printed circuit design film
Then a major component of the spectrum of sensitive and specific chemical reactions photosensitive dry film review
Cover on the substrate, two types of dry, light-and light degradable polymer, photopolymerization-type dry film in the special
Given spectrum of light exposure will harden, from water-soluble substances into water-insoluble and type the photolysis
Just the opposite.
Here we run out of polymeric photosensitivePrinted Circuit Board dry film on the first cover on the substrate, then covered with a layer above the gum line
Film allowed exposure, where black opaque, and vice versa is transparent (circuit part).
Light by exposure to the photosensitive dry film on a result of how it going? All transparent film
Place through the light began to harden dry darker, tightly wrap the surface of the copper foil substrate, the
Like the circuit diagram printed on the substrate, as we have been developing the next steps (using sodium carbonate
Solution to wash away unhardened dry film), so do not dry film protection of the exposed copper foil, which is called off
Membrane (Stripping) process. Next we re-use liquid copper corrosion (corrosion of copper chemicals)
Etching of the substrate, the copper is not wiped dry film protection, hardening under dry route map
It's that presented in the substrate. This method is called the process a man named "image transfer", which
worse.Aluminum PCB Manufacturers manufacturing process accounts for a very important position.
Next is the production of plywood, just follow steps above to create a single panel, even if both sides of the processing also
Is a two-panel and has been, but we often find ourselves in the hands of four plates or boards are