Follow us :

Multilayer PCB

time2011/09/24

Multilayer PCB is between two or more stacked circuit made of, and they have a reliable pre-configured connected. As in all the layers are rolled together before, has completed drilling and plating, this technical violation from the start of the traditional production process. They are by an independent panel consisting of a single. Prior to the RCC, which will be drilling the substrate, through-hole plating, graphics, transfer, developing and etching.

 Multilayer PCB with at least three conductive layers, in which two outer surface, while the rest of the layer is synthetic insulating plate. The electrical connection between them is usually through the board cross section of PTH achieved. Unless otherwise noted, multi-layer printed circuit board and two panels, as is usually plated through orifice. Multilayer PCB by drilling the outer layer is the signal that it is through the hole on the inside edge of the ring of copper balanced in such a way to be plated through the hole.

PS:Multiwire boards

Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin). It was used during the 1980s and 1990s. (Kollmorgen Technologies Corp., U.S. Patent 4,175,816) Multiwire is still available in 2010 through Hitachi. There are other competitive discrete wiring technologies that have been developed (Jumatech [2]).

Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.